Wafer Coring and Dicing Services / San Jose

Descripción

Wafer coring services

Wafer coring is a process that creates smaller wafers from a larger wafer. wafer coring services process of dividing a wafer into several smaller pieces is commonly performed with a laser.

Various tools are available for this process. The scribe tool, for example, is one of the most common.

http://www.dieprepservices.com/wafer-dicing/ » It works by directing a laser beam to a specific area on the wafer surface. The cutting path of the laser is typically straight and involves minimal heat damage near the ablation point. It also produces very straight sidewalls.

Dicing services

In addition to providing coring services, these companies also offer dicing services. Dicing services can be used for a variety of semiconductor materials, including chip capacitors, resistors, and patterned optics.

The starting material size may range from six inches square to eight inches square. The dicing kerf and die size can be as small as.001 inch, depending on the complexity of the workpiece.

The dicing mechanism contains an abrasive blade that rotates with the spindle at high speeds. The blade is made of diamond grit embedded in a nickel-based electroplated matrix. It can easily crush wafers and assemble components.

Using dedicated lines, the blade moves between the active zones of the dice, forming a groove in the substrate material. The laser can be used for a wide variety of processes, including scribing and cutting.

Contact Us

Contact us @ 408-451-2000
Email: sales@dieprepservices.com »
Address: 925 Berryessa Road - San Jose, CA 95133

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